Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532528 | Electronic package and manufacturing method thereof | Chi-Jen Chen, Hsi-Chang Hsu, Chang-Fu Lin, Don-Son Jiang | 2022-12-20 |
| 11516925 | Package stack structure and method for manufacturing the same | Han-Hung Chen, Chang-Fu Lin, Rung-Jeng Lin, Fu-Tang Huang | 2022-11-29 |
| 11482470 | Electronic package and fabrication method thereof | Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin | 2022-10-25 |
| 11410954 | Electronic package, manufacturing method thereof and conductive structure | Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin | 2022-08-09 |