Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482470 | Electronic package and fabrication method thereof | Yu-Lung Huang, Chang-Fu Lin, Yuan-Hung Hsu | 2022-10-25 |
| 11410954 | Electronic package, manufacturing method thereof and conductive structure | Yu-Lung Huang, Chang-Fu Lin, Yuan-Hung Hsu | 2022-08-09 |
| 11315881 | Electronic package and manufacturing method thereof | Chi-Ching Ho, Bo MA | 2022-04-26 |
| 11289346 | Method for fabricating electronic package | Chen-Yu Huang, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo MA | 2022-03-29 |