Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11418002 | Electronic package and method for fabricating the same | Yi-Chian Liao | 2022-08-16 |
| 11289346 | Method for fabricating electronic package | Chen-Yu Huang, Chee-Key Chung, Chang-Fu Lin, Rui-Feng Tai, Bo MA | 2022-03-29 |