Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11516925 | Package stack structure and method for manufacturing the same | Yuan-Hung Hsu, Chang-Fu Lin, Rung-Jeng Lin, Fu-Tang Huang | 2022-11-29 |
| 11380978 | Electronic package and method for fabricating the same | Shi-Min Zhou, Rung-Jeng Lin, Kuo-Hua Yu, Chang-Fu Lin | 2022-07-05 |
| 11289794 | Electronic package | Rung-Jeng Lin, Shi-Min Zhou, Kuo-Hua Yu, Chang-Fu Lin | 2022-03-29 |