Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527491 | Method for fabricating substrate structure | Chun-Tang Lin, Shou-Qi Chang, Yu-Hsiang Hsieh | 2022-12-13 |
| 11227842 | Electronic package and substrate structure having chamfers | Chang-Fu Lin, Chun-Tang Lin, Bo-Hao Chang | 2022-01-18 |