Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532495 | Chip matching system and method thereof | Wu-Hung Yen, Yi-Hsien Huang, Shu-Hua Chen, Shou-Qi Chang | 2022-12-20 |
| 11527491 | Method for fabricating substrate structure | Po-Hao Wang, Shou-Qi Chang, Yu-Hsiang Hsieh | 2022-12-13 |
| 11227842 | Electronic package and substrate structure having chamfers | Po-Hao Wang, Chang-Fu Lin, Bo-Hao Chang | 2022-01-18 |