Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227842 | Electronic package and substrate structure having chamfers | Po-Hao Wang, Chang-Fu Lin, Chun-Tang Lin | 2022-01-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227842 | Electronic package and substrate structure having chamfers | Po-Hao Wang, Chang-Fu Lin, Chun-Tang Lin | 2022-01-18 |