Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456281 | Architecture and processes to enable high capacity memory packages through memory die stacking | Yi Li, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun, Hector Amador +3 more | 2022-09-27 |
| 11450613 | Integrated circuit package with test circuitry for testing a channel between dies | Mayue Xie, Jong-Ru Guo, Zuoguo Wu | 2022-09-20 |
| 11450560 | Microelectronic assemblies having magnetic core inductors | Krishna Bharath, Adel A. Elsherbini, Shawna M. Liff, Kaladhar Radhakrishnan, Johanna M. Swan | 2022-09-20 |
| 11387188 | High density interconnect structures configured for manufacturing and performance | Henning Braunisch, Kemal Aygun, Ajay Jain | 2022-07-12 |
| 11296031 | Dielectric-filled trench isolation of vias | Kemal Aygun, Jianyong Xie | 2022-04-05 |
| 11276635 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Kemal Aygun, Yidnekachew S. Mekonnen, Zhichao Zhang, Jianyong Xie | 2022-03-15 |
| 11244890 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2022-02-08 |
| 11222847 | Enabling long interconnect bridges | Ravindranath V. Mahajan, Henning Braunisch, Kemal Aygun, Sujit Sharan | 2022-01-11 |
| 11222848 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Jianyong Xie | 2022-01-11 |