Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450471 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more | 2022-09-20 |
| 11443892 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Rahul Jain, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more | 2022-09-13 |
| 11417614 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more | 2022-08-16 |
| 11355459 | Embedding magnetic material, in a cored or coreless semiconductor package | Kyu Oh Lee, Rahul Jain, Junnan Zhao, Ji-Yong Park, Cheng Xu +1 more | 2022-06-07 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Junnan Zhao, Ying Wang, Rahul Jain, Andrew J. Brown +3 more | 2022-05-17 |
| 11289263 | Electronic substrates having embedded magnetic material using photo-imagable dielectric layers | Prithwish Chatterjee, Lauren A. Link, Andrew J. Brown | 2022-03-29 |
| 11251113 | Methods of embedding magnetic structures in substrates | Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more | 2022-02-15 |
| 11244912 | Semiconductor package having a coaxial first layer interconnect | Aleksandar Aleksov, Rahul Jain, Kyu Oh Lee, Kristof Darmawikarta, Robert Alan May +2 more | 2022-02-08 |