Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508634 | Semiconductor package structure, electronic device, and method for manufacturing the same | Syu-Tang Liu | 2022-11-22 |
| 11428946 | Method for manufacturing a through substrate via | Yuan-Feng Chiang, Tsung-Tang Tsai | 2022-08-30 |
| 11430750 | Semiconductor device package having an antenna formed over a foaming agent filled cavity in a support layer | Wen-Hung Huang, Yuh-Shan Su | 2022-08-30 |
| 11424212 | Semiconductor package structure and method for manufacturing the same | Chien-Wei Chang, Shang-Wei Yeh, Chung-Hsi Wu | 2022-08-23 |
| 11411073 | Semiconductor package device and method for manufacturing the same | Shao Hsuan CHUANG, Huang-Hsien Chang | 2022-08-09 |
| 11373956 | Semiconductor device package and method of manufacturing the same | Hung-Jung Tu, Hsin Hsiang Wang, Chih-Wei Huang, Shiuan-Yu LIN | 2022-06-28 |
| 11355426 | Wiring structure and method for manufacturing the same | Wen-Hung Huang | 2022-06-07 |
| 11222870 | Semiconductor device package and method of manufacturing the same | Wen-Long LU | 2022-01-11 |