Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424212 | Semiconductor package structure and method for manufacturing the same | Shang-Wei Yeh, Chung-Hsi Wu, Min-Lung Huang | 2022-08-23 |
| 11267099 | Chemical mechanical planarization membrane | Cheng-Ping Chen, Ren-Dou Lee, Sheng-Tai Peng, Tsung-Lung Lai, Tzi-Yi Shieh | 2022-03-08 |