Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424212 | Semiconductor package structure and method for manufacturing the same | Chien-Wei Chang, Chung-Hsi Wu, Min-Lung Huang | 2022-08-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424212 | Semiconductor package structure and method for manufacturing the same | Chien-Wei Chang, Chung-Hsi Wu, Min-Lung Huang | 2022-08-23 |