Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508634 | Semiconductor package structure, electronic device, and method for manufacturing the same | Min-Lung Huang | 2022-11-22 |
| 11289411 | Substrate structure and method for manufacturing the same | Tsung-Tang Tsai, Huang-Hsien Chang, Ching-Ju Chen | 2022-03-29 |
| 11257742 | Wiring structure and method for manufacturing the same | Tsung-Tang Tsai | 2022-02-22 |