Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521958 | Semiconductor device package with conductive pillars and reinforcing and encapsulating layers | Ya Fang Chan | 2022-12-06 |
| 11428946 | Method for manufacturing a through substrate via | Tsung-Tang Tsai, Min-Lung Huang | 2022-08-30 |