Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521958 | Semiconductor device package with conductive pillars and reinforcing and encapsulating layers | Yuan-Feng Chiang | 2022-12-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521958 | Semiconductor device package with conductive pillars and reinforcing and encapsulating layers | Yuan-Feng Chiang | 2022-12-06 |