Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495557 | Semiconductor device and method of manufacturing the same | Jhao-Cheng CHEN, Huang-Hsien Chang, Wen-Long LU, Ching-Ju Chen, Tse-Chuan Chou | 2022-11-08 |
| 11410957 | Semiconductor package structure and method of manufacturing the same | Huang-Hsien Chang | 2022-08-09 |
| 11411073 | Semiconductor package device and method for manufacturing the same | Huang-Hsien Chang, Min-Lung Huang | 2022-08-09 |
| 11398442 | Bonding structure, package structure, and method for manufacturing package structure | Wan-Yu Chang | 2022-07-26 |
| 11262506 | Recessed portion in a substrate and method of forming the same | Huang-Hsien Chang | 2022-03-01 |