Issued Patents 2022
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538760 | Semiconductor package structure and method for manufacturing the same | — | 2022-12-27 |
| 11532542 | Wiring structure and method for manufacturing the same | — | 2022-12-20 |
| 11495557 | Semiconductor device and method of manufacturing the same | Jhao-Cheng CHEN, Huang-Hsien Chang, Shao Hsuan CHUANG, Ching-Ju Chen, Tse-Chuan Chou | 2022-11-08 |
| 11430708 | Package structure and circuit layer structure including dummy trace and manufacturing method therefor | — | 2022-08-30 |
| 11398408 | Semiconductor substrate with trace connected to via at a level within a dielectric layer | — | 2022-07-26 |
| 11362052 | Semiconductor device package and method of manufacturing the same | Chi-Chang Lee | 2022-06-14 |
| 11302644 | Semiconductor package structure and method for manufacturing the same | — | 2022-04-12 |
| 11302594 | Semiconductor package and method of manufacturing the same | — | 2022-04-12 |
| 11296002 | Semiconductor device package and method for manufacturing the same | — | 2022-04-05 |
| 11271312 | Semiconductor device package and method for manufacturing the same | — | 2022-03-08 |
| 11239174 | Semiconductor package structure and method for manufacturing the same | — | 2022-02-01 |
| 11222870 | Semiconductor device package and method of manufacturing the same | Min-Lung Huang | 2022-01-11 |
| 11215762 | Optical device package and method for manufacturing the same | Huang-Hsien Chang, Po Ju Wu, Yu-Cheng Chen | 2022-01-04 |
| 11217520 | Wiring structure, assembly structure and method for manufacturing the same | — | 2022-01-04 |