Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521934 | Semiconductor package including interposer and method of manufacturing the semiconductor package | Jihwang Kim, Choongbin Yim | 2022-12-06 |
| 11437293 | Semiconductor packages having a dam structure | Dongho Kim, Hwanpil Park, Jangwoo Lee | 2022-09-06 |
| 11404382 | Semiconductor package including an embedded semiconductor device | Jihwang Kim, Jeongmin Kang, Hyunkyu Kim, Kyoungsei Choi | 2022-08-02 |
| 11367679 | Semiconductor package including an in interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Eunhee Jung, Kyoungsei Choi | 2022-06-21 |
| 11367688 | Semiconductor package with interposer | Choongbin Yim, Jungwoo Kim, Jihwang Kim, Kyoungsei Choi | 2022-06-21 |
| 11367714 | Semiconductor package device | Jangwoo Lee, Ji Hwang Kim, Yungcheol Kong, Youngbae Kim, Taehwan Kim +1 more | 2022-06-21 |