Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437293 | Semiconductor packages having a dam structure | Dongho Kim, Jongbo Shim, Jangwoo Lee | 2022-09-06 |
| 11315851 | Semiconductor package structure and fabrication method thereof | Youngho Kim | 2022-04-26 |