Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527484 | Dielectric filler material in conductive material that functions as fiducial for an electronic device | Jesse C. Jones, Jason M. Gamba, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan | 2022-12-13 |
| 11521931 | Microelectronic structures including bridges | Jason M. Gamba, Nitin A. Deshpande, Mohit Bhatia, Omkar G. Karhade, Bai Nie +2 more | 2022-12-06 |
| 11355438 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Rahul N. Manepalli | 2022-06-07 |
| 11355961 | Method and system for fast reconfiguration of power supply network in tens of milliseconos after power grid failure | Xiaonan LOU, Qi Zhang, Yuhan Zhang, Nian Liu, Liangliang Zheng | 2022-06-07 |
| 11348718 | Substrate embedded magnetic core inductors and method of making | Srinivas V. Pietambaram, Kristof Darmawikarta, Yonggang Li, Sameer Paital | 2022-05-31 |
| 11232192 | Automatic deployment of application security policy using application manifest and dynamic process analysis in a containerization environment | Glen K. Kosaka, Fei Huang | 2022-01-25 |
| 11227849 | Electroless-catalyst doped-mold materials for integrated-circuit die packaging architectures | Brandon C. Marin, Srinivas V. Pietambaram, Kristof Darmawikarta, Sameer Paital | 2022-01-18 |