| 11521894 |
Partial wrap around top contact |
Ruilong Xie, Julien Frougier, Eric Miller |
2022-12-06 |
| 11515431 |
Enabling residue free gap fill between nanosheets |
Indira Seshadri, Jing Guo, Ruqiang Bao, Muthumanickam Sankarapandian, Nelson Felix |
2022-11-29 |
| 11508823 |
Low capacitance low RC wrap-around-contact |
Ruilong Xie, Jing Guo, Hao Tang, Cheng Chi |
2022-11-22 |
| 11500290 |
Adhesion promoters |
Dario L. Goldfarb, Bharat Kumar, Jing Guo |
2022-11-15 |
| 11501969 |
Direct extreme ultraviolet lithography on hard mask with reverse tone |
Yann Mignot, Yongan Xu, Ashim Dutta, Chi-Chun Liu |
2022-11-15 |
| 11500293 |
Patterning material film stack with hard mask layer configured to support selective deposition on patterned resist layer |
Indira Seshadri, Jing Guo, Ashim Dutta, Nelson Felix |
2022-11-15 |
| 11404317 |
Method for fabricating a semiconductor device including self-aligned top via formation at line ends |
John C. Arnold, Ashim Dutta, Dominik Metzler |
2022-08-02 |
| 11373880 |
Creating different width lines and spaces in a metal layer |
Christopher J. Penny, Ashim Dutta, Abraham Arceo de la Pena |
2022-06-28 |
| 11367617 |
Graded hardmask interlayer for enhanced extreme ultraviolet performance |
Jennifer Church, Dario L. Goldfarb |
2022-06-21 |
| 11355442 |
Forming self-aligned multi-metal interconnects |
Ashim Dutta |
2022-06-07 |
| 11307496 |
Metal brush layer for EUV patterning |
Jing Guo, Jennifer Church, Dario L. Goldfarb |
2022-04-19 |
| 11302573 |
Semiconductor structure with fully aligned vias |
Ashim Dutta, Praveen Joseph, Nelson Felix |
2022-04-12 |
| 11300881 |
Line break repairing layer for extreme ultraviolet patterning stacks |
Luciana Meli Thompson, Jing Guo, Nelson Felix |
2022-04-12 |
| 11251182 |
Staggered stacked vertical crystalline semiconducting channels |
Tsung-Sheng Kang, Tao Li, Ardasheir Rahman, Praveen Joseph, Indira Seshadri |
2022-02-15 |
| 11239077 |
Litho-etch-litho-etch with self-aligned blocks |
Chi-Chun Liu, Nelson Felix, Yann Mignot, John C. Arnold, Allen H. Gabor |
2022-02-01 |
| 11227892 |
MRAM integration with BEOL interconnect including top via |
Ashim Dutta, Chih-Chao Yang, Dominik Metzler |
2022-01-18 |
| 11226561 |
Self-priming resist for generic inorganic hardmasks |
Chi-Chun Liu, Indira Seshadri, Kristin Schmidt, Nelson Felix, Daniel P. Sanders +2 more |
2022-01-18 |
