Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532708 | Stacked three-dimensional field-effect transistors | Lars Liebmann, Jeffrey Smith, Paul Gutwin | 2022-12-20 |
| 11488947 | Highly regular logic design for efficient 3D integration | Lars Liebmann, Jeffrey Smith, Anton J. deVilliers | 2022-11-01 |
| 11469309 | Gate contact structures and cross-coupled contact structures for transistor devices | Ruilong Xie, Youngtag Woo, Bipul C. Paul, Lars Liebmann, Heimanu Niebojewski +3 more | 2022-10-11 |
| 11450671 | Semiconductor apparatus having stacked devices and method of manufacture thereof | Lars Liebmann, Jeffrey Smith, Anton J. deVilliers | 2022-09-20 |
| 11437376 | Compact 3D stacked-CFET architecture for complex logic cells | Lars Liebmann, Jeffrey Smith, Anton J. deVilliers | 2022-09-06 |
| 11342427 | 3D directed self-assembly for nanostructures | Anton J. deVilliers, Jodi Grzeskowiak, Lars Liebmann | 2022-05-24 |
| 11322401 | Reverse contact and silicide process for three-dimensional semiconductor devices | Jeffrey Smith, Lars Liebmann, Hiroki Niimi, Kandabara Tapily, Subhadeep Kal +2 more | 2022-05-03 |
| 11264289 | Method for threshold voltage tuning through selective deposition of high-K metal gate (HKMG) film stacks | Jeffrey Smith, Kandabara Tapily, Lars Liebmann, Mark I. Gardner, H. Jim Fulford +1 more | 2022-03-01 |
| 11264274 | Reverse contact and silicide process for three-dimensional logic devices | Jeffrey Smith, Hiroaki Niimi, Jodi Grzeskowiak, Lars Liebmann, Kandabara Tapily +2 more | 2022-03-01 |
| 11233006 | Metallization lines on integrated circuit products | Ruilong Xie, Lars Liebmann, Geng Han | 2022-01-25 |