Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088105 | Semiconductor device and method for fabricating a semiconductor device | Chooi Mei Chong, Edward Myers, Michael Stadler | 2021-08-10 |
| 11069600 | Semiconductor package with space efficient lead and die pad design | Ke Yan Tean, Thai Kee Gan, Azlina Kassim | 2021-07-20 |
| 10978378 | Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier | Kuok Wai Chan, Christoph Liebl, Bun Kian Tay, Wee Boon Tay, Wae Chet Yong | 2021-04-13 |
| 10971457 | Semiconductor device comprising a composite material clip | Martin Gruber, Thorsten Scharf | 2021-04-06 |
| 10950509 | Semiconductor device with integrated shunt resistor | Rainald Sander, Steffen Thiele | 2021-03-16 |
| 10886186 | Semiconductor package system | Thorsten Scharf, Ralf Otremba, Irmgard Escher-Poeppel, Martin Gruber, Michael Juerss +2 more | 2021-01-05 |