Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069600 | Semiconductor package with space efficient lead and die pad design | Ke Yan Tean, Thomas Bemmerl, Azlina Kassim | 2021-07-20 |
| 11011456 | Lead frames including lead posts in different planes | Lee Shuang Wang, Jo Ean Joanna Chye | 2021-05-18 |