Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211353 | Clips for semiconductor packages | Mohd Kahar Bajuri, Abdul Rahman Mohamed, Siang Kuan Chua | 2021-12-28 |
| 11069600 | Semiconductor package with space efficient lead and die pad design | Thomas Bemmerl, Thai Kee Gan, Azlina Kassim | 2021-07-20 |