Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069600 | Semiconductor package with space efficient lead and die pad design | Ke Yan Tean, Thomas Bemmerl, Thai Kee Gan | 2021-07-20 |
AK
Azlina Kassim
Overall (2021): #521,176 of 548,734Top 95%
1
Patents 2021