Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2021-11-16 |
| 11031373 | Spacer for die-to-die communication in an integrated circuit | Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Steve Ostrander, Thomas Weiss | 2021-06-08 |
| 10916507 | Multiple chip carrier for bridge assembly | Charles L. Arvin, Brian W. Quinlan, Steve Ostrander, Thomas Weiss, Shidong Li | 2021-02-09 |
| 10892249 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2021-01-12 |