Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai +2 more | 2020-12-15 |
| 10699977 | Method of detecting delamination in an integrated circuit package structure | Tsung-Te Chou, Chen-Hua Lin, Huang-Wen Tseng, Chwen-Ming Liu | 2020-06-30 |
| 10629673 | Method for manufacturing semiconductor and structure thereof | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2020-04-21 |