Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10699977 | Method of detecting delamination in an integrated circuit package structure | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Chwen-Ming Liu | 2020-06-30 |
TC
Tsung-Te Chou
Overall (2020): #237,853 of 565,922Top 45%
1
Patents 2020