Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10699977 | Method of detecting delamination in an integrated circuit package structure | Yang-Che Chen, Tsung-Te Chou, Chen-Hua Lin, Huang-Wen Tseng | 2020-06-30 |
| 10629673 | Method for manufacturing semiconductor and structure thereof | Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang | 2020-04-21 |