Issued Patents 2020
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868357 | Massive antenna array architecture for base stations designed for high frequency communications | Georgios Dogiamis, Sasha N. Oster | 2020-12-15 |
| 10852495 | Microelectronic package communication using radio interfaces connected through wiring | Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Gaurav Chawla | 2020-12-01 |
| 10847889 | Patch antenna with isolated feeds | Adewale K Oladeinde | 2020-11-24 |
| 10819445 | Waveguide and transceiver interference mitigation | Georgios Dogiamis, Henning Braunisch, Hyung-Jin Lee, Richard J. Dischler | 2020-10-27 |
| 10804227 | Semiconductor packages with antennas | Adel A. Elsherbini, Sasha N. Oster | 2020-10-13 |
| 10777538 | System on package architecture including structures on die back side | Fay Hua, Johanna M. Swan | 2020-09-15 |
| 10734236 | Electronic devices with components formed by late binding using self-assembled monolayers | Sasha N. Oster, Fay Hua, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan | 2020-08-04 |
| 10734735 | Distributed on-package millimeter-wave radio | Adel A. Elsherbini | 2020-08-04 |
| 10680788 | Waveguide communication with increased link data rate | Georgios Dogiamis, Emanuel Cohen, Sasha N. Oster | 2020-06-09 |
| 10658312 | Embedded millimeter-wave phased array module | Adel A. Elsherbini, Valluri Rao | 2020-05-19 |
| 10629551 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair | 2020-04-21 |
| 10623106 | Orthogonal frequency division multiplexing single sideband transmission over a waveguide | Hyung-Jin Lee, Cho-Ying Lu, Henning Braunisch, Georgios Dogiamis, Richard J. Dischler | 2020-04-14 |
| 10615133 | Die package with superposer substrate for passive components | Valluri Rao | 2020-04-07 |
| 10595410 | Non-planar on-package via capacitor | Fay Hua, Brandon M. Rawlings, Georgios Dogiamis | 2020-03-17 |
| 10594294 | Piezoelectric package-integrated delay lines | Adel A. Elsherbini, Feras Eid, Baris Bicen, Vijay K. Nair, Georgios Dogiamis +2 more | 2020-03-17 |
| 10593636 | Platform with thermally stable wireless interconnects | Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Brandon M. Rawlings, Feras Eid | 2020-03-17 |
| 10573608 | Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package | Georgios Dogiamis, Eric J. Li, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair +1 more | 2020-02-25 |
| 10566672 | Waveguide connector with tapered slot launcher | Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Shawna M. Liff +1 more | 2020-02-18 |
| 10546835 | Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric | Vijay K. Nair, Georgios Dogiamis | 2020-01-28 |