Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770364 | Chip scale package (CSP) including shim die | Hong Shi, Siow Chek Tan, Gamal Refai-Ahmed | 2020-09-08 |
| 10720377 | Electronic device apparatus with multiple thermally conductive paths for heat dissipation | Gamal Refai-Ahmed, Ho Hyung Lee, Hui-Wen Lin, Henley Liu | 2020-07-21 |
| 10629512 | Integrated circuit die with in-chip heat sink | Hong-Tsz Pan, Jonathan Chang, Nui Chong, Henley Liu, Gamal Refai-Ahmed | 2020-04-21 |
| 10593638 | Methods of interconnect for high density 2.5D and 3D integration | Jaspreet S. Gandhi, Henley Liu | 2020-03-17 |
| 10527670 | Testing system for lid-less integrated circuit packages | Gamal Refai-Ahmed, Ivor G. Barber, Jaspreet S. Gandhi, Tien-Yu Lee, Henley Liu +2 more | 2020-01-07 |
| 10529645 | Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management | Jaspreet S. Gandhi, Henley Liu, Tien-Yu Lee, Gamal Refai-Ahmed, Myongseob Kim +2 more | 2020-01-07 |