Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10877202 | Surface light source assembly and refrigerator having the same | Haidong Tang, Guangrui Wu, Ming-Theng Wang, Ning Wang, Falin Yang | 2020-12-29 |
| 10804181 | Heterogeneous thermal interface material for corner and or edge degradation mitigation | Marcus E. Interrante, Sushumna Iruvanti, Tuhin Sinha | 2020-10-13 |
| 10685919 | Reduced-warpage laminate structure | Mark C. Lamorey, Janak G. Patel, Douglas O. Powell, David J. Russell, Peter Slota, Jr. +1 more | 2020-06-16 |
| 10636750 | Step pyramid shaped structure to reduce dicing defects | Kirk D. Peterson, Nicolas Pizzuti, Thomas M. Shaw, Thomas A. Wassick | 2020-04-28 |
| 10636746 | Method of forming an electronic package | Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Sushumna Iruvanti | 2020-04-28 |
| 10607928 | Reduction of laminate failure in integrated circuit (IC) device carrier | Anson J. Call, Sushumna Iruvanti, Brian W. Quinlan, Kamal K. Sikka, Rui Wang | 2020-03-31 |
| 10593564 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2020-03-17 |
| 10566313 | Integrated circuit chip carrier with in-plane thermal conductance layer | Kamal K. Sikka | 2020-02-18 |