Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872879 | Semiconductor package and manufacturing method thereof | Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee +2 more | 2020-12-22 |
| 10818637 | Thin bonded interposer package | Christopher J. Berry, Roger D. St. Amand | 2020-10-27 |
| 10811341 | Semiconductor device with through-mold via | Dong Joo Park, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim +3 more | 2020-10-20 |
| 10747385 | Touch display apparatus | Ju Han Kim, Yong Chan Park, Seung Kyeom Kim | 2020-08-18 |
| 10714408 | Semiconductor devices and methods of making semiconductor devices | Louis W. Nicholls, Roger D. St. Amand, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2020-07-14 |
| 10672676 | Sensor package and manufacturing method thereof | Ji Young Chung, Dong Joo Park, Jae Sung Park, Se Hwan Hong | 2020-06-02 |
| 10600545 | Coil electronic component and method of manufacturing the coil electronic component | Sung Sik Shin | 2020-03-24 |