Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811341 | Semiconductor device with through-mold via | Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Ho Choi, Kwang Ho Kim +3 more | 2020-10-20 |
| 10586761 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Chel Woo Park | 2020-03-10 |