Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811341 | Semiconductor device with through-mold via | Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim +3 more | 2020-10-20 |
| 10672676 | Sensor package and manufacturing method thereof | Ji Young Chung, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2020-06-02 |