Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707181 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Doo Hyun Park, Choon Heung Lee | 2020-07-07 |
| 10672676 | Sensor package and manufacturing method thereof | Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2020-06-02 |
| 10600755 | Method of manufacturing an electronic device and electronic device manufactured thereby | Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Kwangmo Chris Lim | 2020-03-24 |