Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707181 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Ji Young Chung, Choon Heung Lee | 2020-07-07 |
| 10679952 | Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof | Jong Sik Paek, Won Chul Do, Eun Ho Park, Sung Jae Oh | 2020-06-09 |
| 10672699 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2020-06-02 |
| 10535536 | Stiffener package and method of fabricating stiffener package | Jin Young Kim, Seung Jae Lee | 2020-01-14 |