Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811341 | Semiconductor device with through-mold via | Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Kwang Ho Kim +3 more | 2020-10-20 |
| 10643857 | Method of generating layout and method of manufacturing semiconductor devices using same | In-Wook Oh, Dong Hyun Kim, Byung Sung Kim, Sung Keun Park | 2020-05-05 |