Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847474 | Semiconductor package and electromagnetic interference shielding structure for the same | Woon Chun Kim, Jun Heyoung Park, Ji Hye Shim, Gun Lee | 2020-11-24 |
| 10790255 | Fan-out semiconductor package | Woon Chun Kim, Jun Heyoung Park, Ji Hye Shim, Gun Lee | 2020-09-29 |
| 10683391 | Thermoplastic elastomer resin composition for moisture-permeable waterproof film, film and fabric using same | Yu In Jung, Yu-Hyun Kim, Ji-Yong Park, Gun Min LEE, Sang Hyun Moon | 2020-06-16 |
| 10643857 | Method of generating layout and method of manufacturing semiconductor devices using same | In-Wook Oh, Dong Hyun Kim, Byung Sung Kim, Ho Choi | 2020-05-05 |