Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847474 | Semiconductor package and electromagnetic interference shielding structure for the same | Woon Chun Kim, Jun Heyoung Park, Sung Keun Park, Gun Lee | 2020-11-24 |
| 10790255 | Fan-out semiconductor package | Woon Chun Kim, Jun Heyoung Park, Sung Keun Park, Gun Lee | 2020-09-29 |
| 10748828 | Fan-out sensor package | Ha Yong Jung, Jae-Kul Lee, Han Sang Cho, Woon Ha Choi, Jae Min Choi +2 more | 2020-08-18 |
| 10741510 | Semiconductor package | Woon Chun Kim, Seung-Hun Chae | 2020-08-11 |
| 10626288 | Resin composition for printed circuit board, resin varnish using the same, adhesive film, prepreg and printed wiring board | Ki Seok Kim, Ji Eun Woo | 2020-04-21 |
| 10615212 | Fan-out sensor package | Ha Yong Jung, Jae-Kul Lee, Sung Taek Woo, Dong Jin Kim, Han Sang Cho +2 more | 2020-04-07 |