Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847474 | Semiconductor package and electromagnetic interference shielding structure for the same | Woon Chun Kim, Jun Heyoung Park, Ji Hye Shim, Sung Keun Park | 2020-11-24 |
| 10790255 | Fan-out semiconductor package | Woon Chun Kim, Jun Heyoung Park, Ji Hye Shim, Sung Keun Park | 2020-09-29 |