Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10626288 | Resin composition for printed circuit board, resin varnish using the same, adhesive film, prepreg and printed wiring board | Ji Hye Shim, Ki Seok Kim | 2020-04-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10626288 | Resin composition for printed circuit board, resin varnish using the same, adhesive film, prepreg and printed wiring board | Ji Hye Shim, Ki Seok Kim | 2020-04-21 |