Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818637 | Thin bonded interposer package | Christopher J. Berry, Jin Seong Kim | 2020-10-27 |
| 10714408 | Semiconductor devices and methods of making semiconductor devices | Louis W. Nicholls, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang, Robert Francis Darveaux | 2020-07-14 |