Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818637 | Thin bonded interposer package | Roger D. St. Amand, Jin Seong Kim | 2020-10-27 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818637 | Thin bonded interposer package | Roger D. St. Amand, Jin Seong Kim | 2020-10-27 |