Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770312 | Under-fill deflash for a dual-sided ball grid array package | — | 2020-09-08 |
| 10714408 | Semiconductor devices and methods of making semiconductor devices | Louis W. Nicholls, Roger D. St. Amand, Jin Seong Kim, Woon Kab Jung, Sung Jin Yang | 2020-07-14 |
| 10636717 | Packaging for fingerprint sensors and methods of manufacture | Ronald Patrick Huemoeller, David Bolognia, Brett Dunlap | 2020-04-28 |
| 10607944 | Dual-sided radio-frequency package with overmold structure | Howard E. Chen | 2020-03-31 |
| 10593565 | Control of under-fill with a packaging substrate having an integrated trench for a dual-sided ball grid array package | — | 2020-03-17 |
| RE47890 | Packaging for fingerprint sensors and methods of manufacture | Ronald Patrick Huemoeller, David Bolognia, Brett Dunlap | 2020-03-03 |