Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10875145 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2020-12-29 |
| 10821573 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2020-11-03 |
| 10589399 | Textured small pad for chemical mechanical polishing | Jeonghoon Oh, Edwin C. Suarez, Eric Lau, King Yi Heung, Ashwin CHOCKALINGAM +3 more | 2020-03-17 |
| 10593574 | Techniques for combining CMP process tracking data with 3D printed CMP consumables | Rajeev Bajaj, Daniel Redfield, Aniruddh Jagdish Khanna, Mario CORNEJO, Gregory E. Menk +1 more | 2020-03-17 |
| 10537973 | Correction of fabricated shapes in additive manufacturing | Mayu YAMAMURA, Daniel Redfield, Rajeev Bajaj, Hou T. Ng | 2020-01-21 |
| 10537974 | CMP pad construction with composite material properties using additive manufacturing processes | Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. ORILALL, Daniel Redfield, Fred C. Redeker +4 more | 2020-01-21 |