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Advanced polishing pad materials and formulations |
Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Ashwin CHOCKALINGAM |
2020-12-29 |
| 10875145 |
Polishing pads produced by an additive manufacturing process |
Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna, Jason Garcheung Fung +12 more |
2020-12-29 |
| 10843306 |
Printing a chemical mechanical polishing pad |
Barry Chin, Terrance Y. Lee |
2020-11-24 |
| 10821573 |
Polishing pads produced by an additive manufacturing process |
Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna, Jason Garcheung Fung +12 more |
2020-11-03 |
| 10800000 |
Multi-layered nano-fibrous CMP pads |
Robert D. Tolles, Mahendra C. ORILALL, Fred C. Redeker |
2020-10-13 |
| 10773509 |
Pad structure and fabrication methods |
Hou T. Ng, Nag B. Patibandla, Daniel Redfield, Ashwin CHOCKALINGAM, Mayu YAMAMURA +1 more |
2020-09-15 |
| 10618141 |
Apparatus for forming a polishing article that has a desired zeta potential |
Ashwin CHOCKALINGAM, Mahendra C. ORILALL, Mayu YAMAMURA, Boyi Fu, Daniel Redfield |
2020-04-14 |
| 10593574 |
Techniques for combining CMP process tracking data with 3D printed CMP consumables |
Jason Garcheung Fung, Daniel Redfield, Aniruddh Jagdish Khanna, Mario CORNEJO, Gregory E. Menk +1 more |
2020-03-17 |
| 10537973 |
Correction of fabricated shapes in additive manufacturing |
Mayu YAMAMURA, Jason Garcheung Fung, Daniel Redfield, Hou T. Ng |
2020-01-21 |
| 10537974 |
CMP pad construction with composite material properties using additive manufacturing processes |
Kasiraman Krishnan, Mahendra C. ORILALL, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla +4 more |
2020-01-21 |
