Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10875145 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2020-12-29 |
| 10821573 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2020-11-03 |
| 10773509 | Pad structure and fabrication methods | Hou T. Ng, Nag B. Patibandla, Rajeev Bajaj, Daniel Redfield, Ashwin CHOCKALINGAM +1 more | 2020-09-15 |
| 10593574 | Techniques for combining CMP process tracking data with 3D printed CMP consumables | Jason Garcheung Fung, Rajeev Bajaj, Daniel Redfield, Aniruddh Jagdish Khanna, Gregory E. Menk +1 more | 2020-03-17 |