Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10875145 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Boyi Fu, Aniruddh Jagdish Khanna, Jason Garcheung Fung +12 more | 2020-12-29 |
| 10875153 | Advanced polishing pad materials and formulations | Rajeev Bajaj, Daniel Redfield, Boyi Fu, Ashwin CHOCKALINGAM | 2020-12-29 |
| 10821573 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Boyi Fu, Aniruddh Jagdish Khanna, Jason Garcheung Fung +12 more | 2020-11-03 |
| 10800000 | Multi-layered nano-fibrous CMP pads | Robert D. Tolles, Fred C. Redeker, Rajeev Bajaj | 2020-10-13 |
| 10618141 | Apparatus for forming a polishing article that has a desired zeta potential | Ashwin CHOCKALINGAM, Mayu YAMAMURA, Boyi Fu, Rajeev Bajaj, Daniel Redfield | 2020-04-14 |
| 10537974 | CMP pad construction with composite material properties using additive manufacturing processes | Rajeev Bajaj, Kasiraman Krishnan, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla +4 more | 2020-01-21 |